Part Details for TC511002P-10 by Toshiba America Electronic Components
Overview of TC511002P-10 by Toshiba America Electronic Components
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for TC511002P-10
TC511002P-10 CAD Models
TC511002P-10 Part Data Attributes
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TC511002P-10
Toshiba America Electronic Components
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TC511002P-10
Toshiba America Electronic Components
IC,DRAM,STATIC COL,1MX1,CMOS,DIP,18PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Package Description | DIP, DIP18,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 100 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PDIP-T18 | |
JESD-609 Code | e0 | |
Memory Density | 1048576 bit | |
Memory IC Type | STATIC COLUMN DRAM | |
Memory Width | 1 | |
Number of Terminals | 18 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP18,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Refresh Cycles | 512 | |
Standby Current-Max | 0.001 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |