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Overview of TC55VEM416AXBN55 by Toshiba America Electronic Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Computing and Data Storage
CAD Models for TC55VEM416AXBN55 by Toshiba America Electronic Components
Part Data Attributes for TC55VEM416AXBN55 by Toshiba America Electronic Components
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
TOSHIBA CORP
|
|
Part Package Code
|
BGA
|
|
Package Description
|
8 X 11 MM, 0.75 MM PITCH, PLASTIC, TFBGA-48
|
|
Pin Count
|
48
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
55 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B48
|
|
Length
|
11 mm
|
|
Memory Density
|
16777216 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
48
|
|
Number of Words
|
1048576 words
|
|
Number of Words Code
|
1000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
1MX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA48,6X8,30
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Standby Voltage-Min
|
1.5 V
|
|
Supply Current-Max
|
0.035 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.75 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
8 mm
|
Alternate Parts for TC55VEM416AXBN55
This table gives cross-reference parts and alternative options found for TC55VEM416AXBN55. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55VEM416AXBN55, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K6F1616V6B-EF550 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 7 X 7 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | TC55VEM416AXBN55 vs K6F1616V6B-EF550 |
| RMLV1616AGBG-5S2#AC0 | 16Mb Advanced LPSRAM (1M word x 16bit / 2M word x 8bit), FBGA(48), /Tray | Renesas Electronics Corporation | TC55VEM416AXBN55 vs RMLV1616AGBG-5S2#AC0 |
| CS16LV16163KCP55 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 10 MM, ROHS COMPLIANT, MINI BGA-48 | Chiplus Semiconductor Corp | TC55VEM416AXBN55 vs CS16LV16163KCP55 |
| CY62167DV30LL-55BVXIT | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | Infineon Technologies AG | TC55VEM416AXBN55 vs CY62167DV30LL-55BVXIT |
| K6F1616U6B-EF550 | Cache SRAM, 1MX16, 55ns, CMOS, PBGA48, 7 X 7 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | TC55VEM416AXBN55 vs K6F1616U6B-EF550 |
| CY62167DV30LL-55BVXI | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | Cypress Semiconductor | TC55VEM416AXBN55 vs CY62167DV30LL-55BVXI |
| R1LV1616HBG-5SI#S0 | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit), FBGA(48), /Embossed Tape | Renesas Electronics Corporation | TC55VEM416AXBN55 vs R1LV1616HBG-5SI#S0 |
| RMLV1616AGBG-5S2#KC0 | 16Mb Advanced LPSRAM (1M word x 16bit / 2M word x 8bit), FBGA(48), /Embossed Tape | Renesas Electronics Corporation | TC55VEM416AXBN55 vs RMLV1616AGBG-5S2#KC0 |
| K6F1616U6M-EF55 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 9 X 12 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | TC55VEM416AXBN55 vs K6F1616U6M-EF55 |
| CS16LV16163KIP55 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 10 MM, ROHS COMPLIANT, MINI BGA-48 | Chiplus Semiconductor Corp | TC55VEM416AXBN55 vs CS16LV16163KIP55 |