Part Details for TDA8026ET/C3K by NXP Semiconductors
Overview of TDA8026ET/C3K by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Consumer Electronics
Security and Surveillance
Financial Technology (Fintech)
Telecommunications
Price & Stock for TDA8026ET/C3K
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
11AC4266
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Newark | Multiple Smart Card Slot Interface/Tray Rohs Compliant: Yes |Nxp TDA8026ET/C3K Min Qty: 2080 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
|
DISTI #
TDA8026ET/C3K-ND
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DigiKey | IC INTERFACE SPECIALIZED 64TFBGA Min Qty: 2080 Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
|
$3.2901 | Buy Now |
|
DISTI #
TDA8026ET/C3K
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Avnet Americas | TDA8026ET/C3/TFBGA64/STANDARD - Trays (Alt: TDA8026ET/C3K) RoHS: Not Compliant Min Qty: 2080 Package Multiple: 2080 Container: Tray | 0 |
|
$3.0571 / $3.5081 | Buy Now |
|
DISTI #
771-TDA8026ET/C3K
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Mouser Electronics | Interface - Specialized Multiple smart card slot interface RoHS: Compliant | 0 |
|
Order Now | |
|
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2080 Package Multiple: 2080 Container: Tray | 0Tray |
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$3.0600 | Buy Now |
|
DISTI #
TDA8026ET/C3K
|
Avnet Americas | TDA8026ET/C3/TFBGA64/STANDARD - Trays (Alt: TDA8026ET/C3K) RoHS: Not Compliant Min Qty: 2080 Package Multiple: 2080 Container: Tray | 0 |
|
$3.0571 / $3.5081 | Buy Now |
|
DISTI #
TDA8026ET/C3K
|
Avnet Americas | TDA8026ET/C3/TFBGA64/STANDARD - Trays (Alt: TDA8026ET/C3K) RoHS: Not Compliant Min Qty: 2080 Package Multiple: 2080 Container: Tray | 0 |
|
$3.0571 / $3.5081 | Buy Now |
Part Details for TDA8026ET/C3K
TDA8026ET/C3K CAD Models
TDA8026ET/C3K Part Data Attributes
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TDA8026ET/C3K
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
TDA8026ET/C3K
NXP Semiconductors
TDA8026 - Multiple smart card slot interface BGA 64-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | TFBGA-64 | |
| Pin Count | 64 | |
| Manufacturer Package Code | SOT1073-1 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | NXP | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-PBGA-B64 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA64,8X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7 mm |