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Part Details for TDA8356 by NXP Semiconductors
Results Overview of TDA8356 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
Computing and Data Storage
Electronic Manufacturing
Part Details for TDA8356
TDA8356 CAD Models
TDA8356 Part Data Attributes
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TDA8356
NXP Semiconductors
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Datasheet
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TDA8356
NXP Semiconductors
IC VERTICAL DEFLECTION IC, PSIP9, POWER, PLASTIC, SOT-131-2, SIP-9, Deflection IC
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SIP | |
| Package Description | POWER, PLASTIC, SOT-131-2, SIP-9 | |
| Pin Count | 9 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| Blanking Output | NO | |
| Consumer IC Type | VERTICAL DEFLECTION IC | |
| JESD-30 Code | R-PSIP-T9 | |
| JESD-609 Code | e3 | |
| Length | 23.8 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 9 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SIP | |
| Package Equivalence Code | SIP9,.1 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 14.2 mm | |
| Supply Voltage-Max (Vsup) | 25 V | |
| Supply Voltage-Min (Vsup) | 9 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | SINGLE | |
| Width | 4.4 mm |
Alternate Parts for TDA8356
This table gives cross-reference parts and alternative options found for TDA8356. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TDA8356, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| TDA8356/N6 | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PSIP9, POWER, PLASTIC, SOT-131-2, SIP-9, Deflection IC | TDA8356 vs TDA8356/N6 |
| TDA2654 | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PSFM9, PLASTIC, SOT-110B, SIP-9, Deflection IC | TDA8356 vs TDA2654 |
| NTE7135 | NTE Electronics Inc | Check for Price | Vertical Deflection IC, PSFM9, SIP-9 | TDA8356 vs NTE7135 |
| NTE1754 | NTE Electronics Inc | Check for Price | Vertical Deflection IC, PSFM9, SIP-9 | TDA8356 vs NTE1754 |
| TDA3653BU | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PSFM9, POWER, PLASTIC, SOT-110-1, SIP-9, Deflection IC | TDA8356 vs TDA3653BU |
| TDA8143 | STMicroelectronics | Check for Price | HORIZONTAL DEFLECTION IC, PSFM9, SIP-9 | TDA8356 vs TDA8143 |
| TDA8359J/N2,112 | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PZIP9, POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN, Deflection IC | TDA8356 vs TDA8359J/N2,112 |
| TDA3654 | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PSIP9, POWER, PLASTIC, SOT-131, SIP-9, Deflection IC | TDA8356 vs TDA3654 |
| AN5531 | Panasonic Electronic Components | Check for Price | Vertical Deflection IC, Bipolar, PSFM9, HEAT SINK, PLASTIC, SIP-9 | TDA8356 vs AN5531 |
| 935084350112 | NXP Semiconductors | Check for Price | IC VERTICAL DEFLECTION IC, PSFM9, POWER, PLASTIC, SOT-110-1, SIP-9, Deflection IC | TDA8356 vs 935084350112 |