Part Details for TGA4516 by Qorvo
Results Overview of TGA4516 by Qorvo
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TGA4516 Information
TGA4516 by Qorvo is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Part Details for TGA4516
TGA4516 CAD Models
TGA4516 Part Data Attributes
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TGA4516
Qorvo
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Datasheet
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TGA4516
Qorvo
Wide Band High Power Amplifier, 30000MHz Min, 40000MHz Max, 0.110 X 0.091 INCH, 0.004 INCH HEIGHT, ROHS COMPLIANT, DIE-10
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | QORVO INC | |
| Package Description | 0.110 X 0.091 INCH, 0.004 INCH HEIGHT, ROHS COMPLIANT, DIE-10 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.B.2.D | |
| Samacsys Manufacturer | Qorvo | |
| Construction | COMPONENT | |
| Gain | 18 dB | |
| Input Power-Max (CW) | 24.27 dBm | |
| Operating Frequency-Max | 40000 MHz | |
| Operating Frequency-Min | 30000 MHz | |
| RF/Microwave Device Type | WIDE BAND HIGH POWER |
TGA4516 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces short and away from the digital lines. Use a common mode filter or a pi-filter to reduce EMI.
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Adjust the Vd and Vg voltages to achieve a quiescent current of 100-150 mA. Ensure the voltage supply is well-regulated and decoupled to minimize noise. Optimize the bias resistors to achieve a stable operating point.
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Use a heat sink with a thermal conductivity of at least 1 W/m-K. Apply a thin layer of thermal interface material (TIM) to the die. Ensure good airflow around the device and avoid blocking the airflow with nearby components.
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Check the PCB layout for any signs of resonance or oscillation. Verify the biasing and voltage supply. Use a spectrum analyzer to identify any spurious signals. Check for any signs of overheating or thermal runaway.
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Use a shielded enclosure to reduce radiated emissions. Ensure good grounding and bonding of the PCB and metal components. Use EMI filters or common mode chokes to reduce conducted emissions.