Part Details for THGBMJG6C1LBAB7 by KIOXIA
Results Overview of THGBMJG6C1LBAB7 by KIOXIA
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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THGBMJG6C1LBAB7 Information
THGBMJG6C1LBAB7 by KIOXIA is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for THGBMJG6C1LBAB7
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
THGBMJG6C1LBAB7
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Avnet Americas | Flash Memory Card 8G-bytes 2.7V to 3.6V e-MMC 153-Pin FBGA - Trays (Alt: THGBMJG6C1LBAB7) RoHS: Not Compliant Min Qty: 760 Package Multiple: 760 Container: Tray | 0 |
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RFQ | |
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DISTI #
THGBMJG6C1LBAB7
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Avnet Asia | Flash Memory Card 8G-bytes 2.7V to 3.6V e-MMC 153-Pin FBGA - Trays (Alt: THGBMJG6C1LBAB7) RoHS: Compliant Min Qty: 760 Package Multiple: 760 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for THGBMJG6C1LBAB7
THGBMJG6C1LBAB7 CAD Models
THGBMJG6C1LBAB7 Part Data Attributes
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THGBMJG6C1LBAB7
KIOXIA
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Datasheet
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THGBMJG6C1LBAB7
KIOXIA
Flash Module, 8GX8, PBGA153, VFBGA-153
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | KIOXIA HOLDINGS CORP | |
| Package Description | VFBGA-153 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 52 MHz | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 13 mm | |
| Memory Density | 68719476736 bit | |
| Memory IC Type | Embedded MMC | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA153,14X14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3.3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Serial Bus Type | EMMC 5.1 | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Type | MLC NAND TYPE | |
| Width | 11.5 mm |