Part Details for THGVS4G8D8EBAI2 by Toshiba America Electronic Components
Results Overview of THGVS4G8D8EBAI2 by Toshiba America Electronic Components
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
THGVS4G8D8EBAI2 Information
THGVS4G8D8EBAI2 by Toshiba America Electronic Components is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for THGVS4G8D8EBAI2
THGVS4G8D8EBAI2 CAD Models
THGVS4G8D8EBAI2 Part Data Attributes
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THGVS4G8D8EBAI2
Toshiba America Electronic Components
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Datasheet
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THGVS4G8D8EBAI2
Toshiba America Electronic Components
THGVS4G8D8EBAI2
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 50 MHz | |
| JESD-30 Code | R-PBGA-B169 | |
| Memory Density | 137438953472 bit | |
| Memory IC Type | FLASH CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 169 | |
| Number of Words | 34359738368 words | |
| Number of Words Code | 32000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 32GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | SERIAL | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Type | NAND TYPE |