Part Details for TLE92623QXV33XUMA1 by Infineon Technologies AG
Overview of TLE92623QXV33XUMA1 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Automotive
Price & Stock for TLE92623QXV33XUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1305 |
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RFQ | ||
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DISTI #
SP001238090
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EBV Elektronik | (Alt: SP001238090) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for TLE92623QXV33XUMA1
TLE92623QXV33XUMA1 CAD Models
TLE92623QXV33XUMA1 Part Data Attributes
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TLE92623QXV33XUMA1
Infineon Technologies AG
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Datasheet
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TLE92623QXV33XUMA1
Infineon Technologies AG
Interface Circuit, VQFN-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Infineon | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-XQCC-N48 | |
| Length | 7 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max | 28 V | |
| Supply Voltage-Min | 5.5 V | |
| Supply Voltage-Nom | 13.5 V | |
| Surface Mount | YES | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7 mm |