Datasheets
TMS3705GDRQ1 by: Texas Instruments

LF Reader IC 16-SOIC -40 to 85

Part Details for TMS3705GDRQ1 by Texas Instruments

Results Overview of TMS3705GDRQ1 by Texas Instruments

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Applications Consumer Electronics Security and Surveillance Internet of Things (IoT) Transportation and Logistics Automotive

TMS3705GDRQ1 Information

TMS3705GDRQ1 by Texas Instruments is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for TMS3705GDRQ1

Part # Distributor Description Stock Price Buy
LCSC SOIC-16 RFID ICs ROHS 15
  • 1 $8.7414
  • 10 $8.5516
  • 30 $8.4246
  • 100 $8.2976
$8.2976 / $8.7414 Buy Now

Part Details for TMS3705GDRQ1

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TMS3705GDRQ1 Part Data Attributes

TMS3705GDRQ1 Texas Instruments
Buy Now Datasheet
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TMS3705GDRQ1 Texas Instruments LF Reader IC 16-SOIC -40 to 85
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature Frequency range : 134.2 kHz
Data Rate 8 Mbps
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm
Moisture Sensitivity Level 2
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Voltage-Nom 5 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

TMS3705GDRQ1 Frequently Asked Questions (FAQ)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using decoupling capacitors.

  • The TMS3705GDRQ1 has a thermal pad that must be connected to a heat sink or a thermal via to dissipate heat. Ensure good thermal conductivity between the device and the heat sink, and follow the recommended thermal design guidelines in the datasheet.

  • The recommended power-up sequence is to apply the power supply voltage (VCC) before the input clock signal (CLKIN). This ensures that the internal bias circuitry is properly initialized before the clock signal is applied.

  • Start by verifying the power supply voltage, clock signal, and input signals. Check for proper PCB layout and thermal management. Use oscilloscopes or logic analyzers to debug the signals. Consult the datasheet and application notes for troubleshooting guidelines and contact Texas Instruments support if necessary.

  • The TMS3705GDRQ1 is not specifically designed for radiation-hardened or high-reliability applications. However, Texas Instruments offers other devices that are designed for such applications. Consult the datasheet and application notes for specific information on the device's radiation tolerance and reliability.

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