Part Details for TMSDM6467CCUT6TAN by Texas Instruments
Overview of TMSDM6467CCUT6TAN by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TMSDM6467CCUT6TAN
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-TMSDM6467CCUT6TAN-TI-ND
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DigiKey | IC SOC DIGITAL MEDIA 529FCBGA Min Qty: 4 Lead time: 26 Weeks Container: Tray MARKETPLACE PRODUCT |
116 In Stock |
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$84.6900 | Buy Now |
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DISTI #
TMSDM6467CCUT6TAN-ND
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DigiKey | IC SOC DIGITAL MEDIA 529FCBGA Min Qty: 4 Lead time: 26 Weeks Container: Tray | Limited Supply - Call |
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$92.6527 | Buy Now |
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Rochester Electronics | Microprocessor Circuit, PBGA529 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 116 |
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$72.6800 / $85.5000 | Buy Now |
Part Details for TMSDM6467CCUT6TAN
TMSDM6467CCUT6TAN CAD Models
TMSDM6467CCUT6TAN Part Data Attributes:
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TMSDM6467CCUT6TAN
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TMSDM6467CCUT6TAN
Texas Instruments
Digital Media System-on-Chip 529-FCBGA
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-529 | |
| Pin Count | 529 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B529 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 529 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.3 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |