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Part Details for TP5531-TR by 3peak Incorporated
Results Overview of TP5531-TR by 3peak Incorporated
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
Entertainment and Gaming
TP5531-TR Information
TP5531-TR by 3peak Incorporated is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Part Details for TP5531-TR
TP5531-TR CAD Models
TP5531-TR Part Data Attributes
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TP5531-TR
3peak Incorporated
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Datasheet
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TP5531-TR
3peak Incorporated
Operational Amplifier,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | 3PEAK INC | |
| Package Description | SOT-23, 5 PIN | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | 3Peak Incorporated | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Common-mode Reject Ratio-Min | 100 dB | |
| Common-mode Reject Ratio-Nom | 120 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 20 µV | |
| JESD-30 Code | R-PDSO-G5 | |
| Length | 2.92 mm | |
| Low-Bias | YES | |
| Low-Offset | YES | |
| Micropower | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LSSOP | |
| Package Equivalence Code | TSOP5/6,.11,37 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power | NO | |
| Programmable Power | NO | |
| Seated Height-Max | 1.25 mm | |
| Slew Rate-Nom | 0.16 V/us | |
| Supply Current-Max | 0.065 mA | |
| Supply Voltage Limit-Max | 6 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.95 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Unity Gain BW-Nom | 350 | |
| Voltage Gain-Min | 100000 | |
| Wideband | NO | |
| Width | 1.6 mm |
Alternate Parts for TP5531-TR
This table gives cross-reference parts and alternative options found for TP5531-TR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TP5531-TR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MAX410BCSA | Rochester Electronics LLC | Check for Price | Operational Amplifier, 1 Func, 350uV Offset-Max, BIPolar, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | TP5531-TR vs MAX410BCSA |
| MAX410BCSA+T | Maxim Integrated Products | Check for Price | Operational Amplifier, 1 Func, 350uV Offset-Max, BIPolar, PDSO8, 0.150 INCH, MO-012, SO-8 | TP5531-TR vs MAX410BCSA+T |
| MAX410BCSA | Analog Devices Inc | Check for Price | Operational Amplifier | TP5531-TR vs MAX410BCSA |
| MAX410CSA | Rochester Electronics LLC | Check for Price | Operational Amplifier, 1 Func, 350uV Offset-Max, BIPolar, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | TP5531-TR vs MAX410CSA |
| MAX410CSA | Analog Devices Inc | Check for Price | Operational Amplifier | TP5531-TR vs MAX410CSA |
| MAX410CSA+T | Analog Devices Inc | Check for Price | Single/Dual/Quad, 28MHz, Low-Noise, Low-Voltage, Precision Op Amps, 8-SOIC_N-150_MIL, 8 Pins, 0 to 70C | TP5531-TR vs MAX410CSA+T |
| MAX410ESA+T | Analog Devices Inc | Check for Price | Single/Dual/Quad, 28MHz, Low-Noise, Low-Voltage, Precision Op Amps, 8-SOIC_N-150_MIL, 8 Pins, -40 to 85C | TP5531-TR vs MAX410ESA+T |
| TP5531U-CR | 3peak Incorporated | Check for Price | Operational Amplifier, | TP5531-TR vs TP5531U-CR |
| MAX410BCSA+T | Analog Devices Inc | Check for Price | Single/Dual/Quad, 28MHz, Low-Noise, Low-Voltage, Precision Op Amps, 8-SOIC_N-150_MIL, 8 Pins, 0 to 70C | TP5531-TR vs MAX410BCSA+T |
| MAX410BCSA | Maxim Integrated Products | Check for Price | Operational Amplifier, 1 Func, 350uV Offset-Max, BIPolar, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | TP5531-TR vs MAX410BCSA |
TP5531-TR Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the PCB traces as short and wide as possible can help reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink. Additionally, derating the device's power dissipation according to the ambient temperature can help prevent overheating.
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The recommended soldering conditions for the TP5531-TR involve using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F) to prevent damage to the device.
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To troubleshoot issues with the TP5531-TR, start by verifying the input voltage, output current, and ambient temperature are within the recommended operating conditions. Check for proper PCB layout, thermal design, and soldering quality. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting and fault diagnosis.
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Yes, the TP5531-TR is a high-frequency device, and proper EMI/EMC design considerations are essential to ensure reliable operation. This includes using shielded cables, placing the device away from sensitive analog circuits, and following good PCB layout practices to minimize radiation and susceptibility. Additionally, consider using EMI filters or shielding components to reduce electromagnetic interference.