Part Details for TSI578-10GIL by Integrated Device Technology Inc
Overview of TSI578-10GIL by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Price & Stock for TSI578-10GIL
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 2485 |
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RFQ |
Part Details for TSI578-10GIL
TSI578-10GIL CAD Models
TSI578-10GIL Part Data Attributes:
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TSI578-10GIL
Integrated Device Technology Inc
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Datasheet
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TSI578-10GIL
Integrated Device Technology Inc
FCBGA-675, Tray
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | FCBGA | |
| Pin Count | 675 | |
| Manufacturer Package Code | HM675 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B675 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 675 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA675,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.55 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 27 mm |