There are no models available for this part yet.
Overview of W29N01GVDIAA by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for W29N01GVDIAA by Winbond Electronics Corp
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
W29N01GVDIAA-ND
|
DigiKey | IC FLASH 1GBIT PARALLEL 48-VFBGA Lead time: 28 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now |
CAD Models for W29N01GVDIAA by Winbond Electronics Corp
Part Data Attributes for W29N01GVDIAA by Winbond Electronics Corp
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
|
Package Description
|
VFBGA-48
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
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|
Samacsys Manufacturer
|
Winbond
|
|
Data Retention Time-Min
|
10
|
|
JESD-30 Code
|
R-PBGA-B48
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|
Length
|
8 mm
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Memory Density
|
1073741824 bit
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Memory IC Type
|
FLASH
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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48
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Number of Words
|
134217728 words
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|
Number of Words Code
|
128000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
128MX8
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
VFBGA
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Package Equivalence Code
|
BGA48,6X8,32
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|
Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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Parallel/Serial
|
PARALLEL
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Programming Voltage
|
3.3 V
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Seated Height-Max
|
1 mm
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Standby Current-Max
|
0.00005 A
|
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Supply Current-Max
|
0.035 mA
|
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Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
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Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
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Terminal Position
|
BOTTOM
|
|
Type
|
SLC NAND TYPE
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Width
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6.5 mm
|
|
Write Cycle Time-Max (tWC)
|
0.025 ms
|