Datasheets
W632GU6MB-12 by: Winbond Electronics Corp

DDR DRAM, 128MX16, CMOS, PBGA96, VFBGA-96

Part Details for W632GU6MB-12 by Winbond Electronics Corp

Overview of W632GU6MB-12 by Winbond Electronics Corp

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Price & Stock for W632GU6MB-12

Part # Distributor Description Stock Price Buy
NAC 2Gb DDR3L 1.35V SDRAM, x16, 800MHz, WBGA96 Package RoHS: Compliant Package Multiple: 1 0
RFQ
Win Source Electronics IC DRAM 2G PARALLEL 96VFBGA 19202
  • 12 $4.4285
  • 25 $4.1428
  • 38 $4.0000
  • 54 $3.7143
  • 71 $3.5714
  • 88 $3.4286
$3.4286 / $4.4285 Buy Now

Part Details for W632GU6MB-12

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W632GU6MB-12 Part Data Attributes

W632GU6MB-12 Winbond Electronics Corp
Buy Now Datasheet
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W632GU6MB-12 Winbond Electronics Corp DDR DRAM, 128MX16, CMOS, PBGA96, VFBGA-96
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA-96
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Date Of Intro 2017-05-24
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96
Length 13 mm
Memory Density 2147483648 bit
Memory IC Type DDR3L DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 128MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

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