W83L950D
Winbond Electronics Corp
Description: Microprocessor Circuit, PQFP80

Overview of W83L950D by Winbond Electronics Corp

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  • Number of Functional Equivalents: ( 0 crosses )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Electronic Manufacturing Entertainment and Gaming

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Part Data Attributes for W83L950D by Winbond Electronics Corp

W83L950D
Winbond Electronics Corp
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
Package Description
QFP, QFP80,.55SQ,20
Reach Compliance Code
unknown
HTS Code
8542.31.00.01
JESD-30 Code
S-PQFP-G80
Number of Terminals
80
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
QFP
Package Equivalence Code
QFP80,.55SQ,20
Package Shape
SQUARE
Package Style
FLATPACK
Qualification Status
Not Qualified
Surface Mount
YES
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
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