Part Details for WED9LC6816V1612BI by Mercury Systems Inc
Results Overview of WED9LC6816V1612BI by Mercury Systems Inc
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WED9LC6816V1612BI Information
WED9LC6816V1612BI by Mercury Systems Inc is an Other Memory IC.
Other Memory ICs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for WED9LC6816V1612BI
WED9LC6816V1612BI CAD Models
WED9LC6816V1612BI Part Data Attributes
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WED9LC6816V1612BI
Mercury Systems Inc
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Datasheet
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WED9LC6816V1612BI
Mercury Systems Inc
Memory Circuit, 4MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | LG-MAX; WD-MAX; SEATED HT-CALCULATED | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 22.1 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 2.58 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14.1 mm |