Part Details for XA6SLX9-2FTG256Q by AMD
Overview of XA6SLX9-2FTG256Q by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XA6SLX9-2FTG256Q
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XA6SLX9-2FTG256Q-ND
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DigiKey | IC FPGA 186 I/O 256FTBGA Min Qty: 7 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$55.4400 | Buy Now |
DISTI #
XA6SLX9-2FTG256Q
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Avnet Americas | FPGA XA Spartan-6 Family 9152 Cells 45nm (CMOS) Technology 1.2V 256-Pin TFBGA - Trays (Alt: XA6SLX9-2FTG256Q) RoHS: Compliant Min Qty: 7 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 3485 Partner Stock |
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$47.9562 | Buy Now |
DISTI #
XA6SLX9-2FTG256Q
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Avnet Americas | FPGA XA Spartan-6 Family 9152 Cells 45nm (CMOS) Technology 1.2V 256-Pin TFBGA - Trays (Alt: XA6SLX9-2FTG256Q) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$52.8660 | Buy Now |
DISTI #
217-XA6SLX9-2FTG256Q
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Mouser Electronics | FPGA - Field Programmable Gate Array XA6SLX9-2FTG256Q RoHS: Compliant | 1 |
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$55.4300 | Buy Now |
Part Details for XA6SLX9-2FTG256Q
XA6SLX9-2FTG256Q CAD Models
XA6SLX9-2FTG256Q Part Data Attributes
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XA6SLX9-2FTG256Q
AMD
Buy Now
Datasheet
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Compare Parts:
XA6SLX9-2FTG256Q
AMD
Field Programmable Gate Array, 62.5MHz, 9152-Cell, PBGA256,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 62.5 MHz | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 186 | |
Number of Logic Cells | 9152 | |
Number of Outputs | 186 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |