Part Details for XA7Z010-1CLG225Q by AMD Xilinx
Overview of XA7Z010-1CLG225Q by AMD Xilinx
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Part Details for XA7Z010-1CLG225Q
XA7Z010-1CLG225Q CAD Models
XA7Z010-1CLG225Q Part Data Attributes
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XA7Z010-1CLG225Q
AMD Xilinx
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Datasheet
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XA7Z010-1CLG225Q
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA225, 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LFBGA, BGA225,15X15,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks | |
| JESD-30 Code | S-PBGA-B225 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA225,15X15,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.5 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |