Part Details for XAZU3EG-L1SFVC784I by AMD Xilinx
Overview of XAZU3EG-L1SFVC784I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for XAZU3EG-L1SFVC784I
XAZU3EG-L1SFVC784I CAD Models
XAZU3EG-L1SFVC784I Part Data Attributes
|
XAZU3EG-L1SFVC784I
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XAZU3EG-L1SFVC784I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA784, FCBGA-784
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-784 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 784 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA784,28X28,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Seated Height-Max | 3.32 mm | |
Supply Voltage-Nom | 0.72 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |