There are no models available for this part yet.
Overview of XC17S10XLVO8I by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Computing and Data Storage
Telecommunications
CAD Models for XC17S10XLVO8I by AMD Xilinx
Part Data Attributes for XC17S10XLVO8I by AMD Xilinx
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
TSOP
|
Package Description
|
PLASTIC, TSOP-8
|
Pin Count
|
8
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Clock Frequency-Max (fCLK)
|
10 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDSO-G8
|
JESD-609 Code
|
e0
|
Length
|
4.9 mm
|
Memory Density
|
95752 bit
|
Memory IC Type
|
MEMORY CIRCUIT
|
Memory Width
|
1
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
8
|
Number of Words
|
95752 words
|
Number of Words Code
|
95752
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
95752X1
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSOP2
|
Package Equivalence Code
|
TSOP8,.25
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
225
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Standby Current-Max
|
0.00005 A
|
Supply Current-Max
|
0.005 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
3 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
3.9 mm
|
Alternate Parts for XC17S10XLVO8I
This table gives cross-reference parts and alternative options found for XC17S10XLVO8I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17S10XLVO8I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XC17S10XLPD8I | Memory Circuit, 95752X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10XLPD8I |
XC17S10VO8I | Memory Circuit, 95008X1, CMOS, PDSO8, PLASTIC, TSOP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10VO8I |
XC17S10PD8C | Memory Circuit, 95008X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10PD8C |
XC17S10XLPDG8I | Memory Circuit, 95752X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10XLPDG8I |
XC17S05XLPD8I | Memory Circuit, 54544X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S05XLPD8I |
XC17S10VO8C | Memory Circuit, 95008X1, CMOS, PDSO8, PLASTIC, TSOP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10VO8C |
XC17S10XLPD8C | Memory Circuit, 95752X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10XLPD8C |
XC17S10XLVOG8I | Memory Circuit, 95752X1, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, TSOP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10XLVOG8I |
XC17S10VOG8C | Memory Circuit, 95008X1, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, TSOP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S10VOG8C |
XC17S05XLPDG8I | Memory Circuit, 54544X1, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S10XLVO8I vs XC17S05XLPDG8I |
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