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Overview of XC2C32A-6CPG56I by AMD
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XC2C32A-6CPG56I by AMD
Part Data Attributes for XC2C32A-6CPG56I by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56
|
Reach Compliance Code
|
compliant
|
Samacsys Manufacturer
|
AMD
|
Additional Feature
|
REAL DIGITAL DESIGN TECHNOLOGY
|
Clock Frequency-Max
|
300 MHz
|
In-System Programmable
|
YES
|
JESD-30 Code
|
S-PBGA-B56
|
JESD-609 Code
|
e1
|
JTAG BST
|
YES
|
Length
|
6 mm
|
Moisture Sensitivity Level
|
3
|
Number of I/O Lines
|
33
|
Number of Macro Cells
|
32
|
Number of Terminals
|
56
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
33 I/O
|
Output Function
|
MACROCELL
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LFBGA
|
Package Equivalence Code
|
BGA56,10X10,20
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
260
|
Programmable Logic Type
|
FLASH PLD
|
Propagation Delay
|
6 ns
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.35 mm
|
Supply Voltage-Max
|
1.9 V
|
Supply Voltage-Min
|
1.7 V
|
Supply Voltage-Nom
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
6 mm
|
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