Part Details for XC2C512-7FGG324C by AMD
Overview of XC2C512-7FGG324C by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for XC2C512-7FGG324C
XC2C512-7FGG324C CAD Models
XC2C512-7FGG324C Part Data Attributes
|
XC2C512-7FGG324C
AMD
Buy Now
Datasheet
|
Compare Parts:
XC2C512-7FGG324C
AMD
Flash PLD, 7.5ns, 512-Cell, PLA-Type, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | AMD | |
Additional Feature | YES | |
Architecture | PLA-TYPE | |
Clock Frequency-Max | 119 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
JTAG BST | YES | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 270 | |
Number of Inputs | 270 | |
Number of Macro Cells | 512 | |
Number of Outputs | 270 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 0 DEDICATED INPUTS, 270 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FLASH PLD | |
Propagation Delay | 7.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.5 mm | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm |