There are no models available for this part yet.
Overview of XC2S200-6FG256C by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 1 replacement )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 1 option )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Price & Stock for XC2S200-6FG256C by AMD Xilinx
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | 5 |
|
RFQ | ||||
Quest Components | Field-Programmable Gate Array, 5292 Cell, 256 Pin, Plastic, BGA | 157 |
|
$163.7775 / $191.0738 | Buy Now | ||
Quest Components | Field-Programmable Gate Array, 5292 Cell, 256 Pin, Plastic, BGA | 87 |
|
$131.0220 / $163.7775 | Buy Now | ||
Quest Components | Field-Programmable Gate Array, 5292 Cell, 256 Pin, Plastic, BGA | 1 |
|
$57.5000 | Buy Now | ||
Quest Components | Field-Programmable Gate Array, 5292 Cell, 256 Pin, Plastic, BGA | 1 |
|
$191.0738 | Buy Now |
CAD Models for XC2S200-6FG256C by AMD Xilinx
Part Data Attributes for XC2S200-6FG256C by AMD Xilinx
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
BGA
|
Pin Count
|
256
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.39.00.01
|
Factory Lead Time
|
52 Weeks
|
Additional Feature
|
MAXIMUM USABLE GATES 200000
|
Clock Frequency-Max
|
263 MHz
|
Combinatorial Delay of a CLB-Max
|
0.6 ns
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e0
|
Length
|
17 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
1176
|
Number of Equivalent Gates
|
200000
|
Number of Inputs
|
180
|
Number of Logic Cells
|
5292
|
Number of Outputs
|
176
|
Number of Terminals
|
256
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
1176 CLBS, 200000 GATES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA256,16X16,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
225
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2 mm
|
Supply Voltage-Max
|
2.625 V
|
Supply Voltage-Min
|
2.375 V
|
Supply Voltage-Nom
|
2.5 V
|
Surface Mount
|
YES
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
17 mm
|
Alternate Parts for XC2S200-6FG256C
This table gives cross-reference parts and alternative options found for XC2S200-6FG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2S200-6FG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XC2S200-6FGG256C | Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, PBGA256, FBGA-256 | AMD Xilinx | XC2S200-6FG256C vs XC2S200-6FGG256C |
Related Parts for XC2S200-6FG256C
-
XC2S200-6FG456CField Programmable Gate Arrays
-
XC2C256-6TQ144CProgrammable Logic Devices
-
XC226756F66LACKXUMA1Microcontrollers
-
THL3-2411WIOther Analog ICs
-
TPS6590376ZWSRPower Management Circuits
-
AUIPS6021STRLPeripheral Drivers
-
X28HC64PZ-12EEPROMs
-
STW13NK60ZPower Field-Effect Transistors
-
WP81348M0828Other uPs/uCs/Peripheral ICs