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XC2S200-6FGG256C by:

Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, PBGA256, FBGA-256

Part Details for XC2S200-6FGG256C by AMD Xilinx

Overview of XC2S200-6FGG256C by AMD Xilinx

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Applications Computing and Data Storage

Price & Stock for XC2S200-6FGG256C

Part # Distributor Description Stock Price Buy
Chip 1 Exchange INSTOCK 994
RFQ
Chip1Cloud IC FPGA 176 I/O 256FBGA 1120
RFQ

Part Details for XC2S200-6FGG256C

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XC2S200-6FGG256C Part Data Attributes:

XC2S200-6FGG256C AMD Xilinx
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XC2S200-6FGG256C AMD Xilinx Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, PBGA256, FBGA-256
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Additional Feature MAXIMUM USABLE GATES 200000
Clock Frequency-Max 263 MHz
Combinatorial Delay of a CLB-Max 0.6 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 1176
Number of Equivalent Gates 200000
Number of Inputs 284
Number of Logic Cells 5292
Number of Outputs 284
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1176 CLBS, 200000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

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