Part Details for XC2S30-6CSG144C by AMD
Overview of XC2S30-6CSG144C by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC2S30-6CSG144C
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
98AH6904
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Newark | Xc2S30-6Csg144C Rohs Compliant: Yes |Amd XC2S30-6CSG144C RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$46.4100 | Buy Now |
Part Details for XC2S30-6CSG144C
XC2S30-6CSG144C CAD Models
XC2S30-6CSG144C Part Data Attributes
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XC2S30-6CSG144C
AMD
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Datasheet
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XC2S30-6CSG144C
AMD
Field Programmable Gate Array, 216 CLBs, 30000 Gates, 263MHz, 972-Cell, PBGA144,
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | AMD | |
Additional Feature | MAXIMUM USABLE GATES 30000 | |
Clock Frequency-Max | 263 MHz | |
Combinatorial Delay of a CLB-Max | 0.6 ns | |
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 216 | |
Number of Equivalent Gates | 30000 | |
Number of Inputs | 92 | |
Number of Logic Cells | 972 | |
Number of Outputs | 92 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 216 CLBS, 30000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm |