Part Details for XC2VP30-6FF1152C by AMD Xilinx
Overview of XC2VP30-6FF1152C by AMD Xilinx
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XC2VP30-6FF1152C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | FPGA, 3424 CLBS, 1200 MHZ, PBGA1152 | 5 |
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$343.0000 / $367.5000 | Buy Now |
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Quest Components | FPGA, 3424 CLBS, 1200 MHZ, PBGA1152 | 8 |
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$1,130.6171 / $1,319.0532 | Buy Now |
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Chip1Cloud | IC FPGA 644 I/O 1152FCBGA | 910 |
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RFQ | |
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Perfect Parts Corporation | 93 |
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RFQ |
Part Details for XC2VP30-6FF1152C
XC2VP30-6FF1152C CAD Models
XC2VP30-6FF1152C Part Data Attributes
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XC2VP30-6FF1152C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC2VP30-6FF1152C
AMD Xilinx
Field Programmable Gate Array, 3424 CLBs, 1200MHz, 30816-Cell, CMOS, PBGA1152, 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FCBGA-1152
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FCBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 1200 MHz | |
| Combinatorial Delay of a CLB-Max | 0.32 ns | |
| JESD-30 Code | S-PBGA-B1152 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 3424 | |
| Number of Inputs | 644 | |
| Number of Logic Cells | 30816 | |
| Number of Outputs | 644 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 3424 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.4 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm |
Alternate Parts for XC2VP30-6FF1152C
This table gives cross-reference parts and alternative options found for XC2VP30-6FF1152C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2VP30-6FF1152C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC2VP30-6FFG1152C | Field Programmable Gate Array, 3424 CLBs, 1200MHz, 30816-Cell, CMOS, PBGA1152, 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FCBGA-1152 | AMD Xilinx | XC2VP30-6FF1152C vs XC2VP30-6FFG1152C |