Part Details for XC3S1000-5FGG456C by AMD
Overview of XC3S1000-5FGG456C by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC3S1000-5FGG456C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC3S1000-5FGG456C-ND
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DigiKey | IC FPGA 333 I/O 456FBGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Limited Supply - Call |
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$175.5000 | Buy Now |
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DISTI #
XC3S1000-5FGG456C
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Avnet Americas | FPGA Spartan-3 Family 1M Gates 17280 Cells 725MHz 90nm Technology 1.2V 456-Pin F-BGA - Trays (Alt: XC3S1000-5FGG456C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 0 |
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$150.0525 | Buy Now |
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DISTI #
217-C3S1000-5FGG456C
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Mouser Electronics | FPGA - Field Programmable Gate Array 1000000 SYSTEM GATE 1.2 VOLT FPGA RoHS: Compliant | 169 |
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$175.4800 | Buy Now |
Part Details for XC3S1000-5FGG456C
XC3S1000-5FGG456C CAD Models
XC3S1000-5FGG456C Part Data Attributes
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XC3S1000-5FGG456C
AMD
Buy Now
Datasheet
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Compare Parts:
XC3S1000-5FGG456C
AMD
Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 725MHz, 17280-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 23 X 23 MM, LEAD FREE, FBGA-456 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 725 MHz | |
| Combinatorial Delay of a CLB-Max | 0.53 ns | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1920 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 333 | |
| Number of Logic Cells | 17280 | |
| Number of Outputs | 333 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1920 CLBS, 1000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |