Part Details for XC3S1400AN-5FGG676C by AMD
Overview of XC3S1400AN-5FGG676C by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC3S1400AN-5FGG676C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-1600-ND
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DigiKey | IC FPGA 502 I/O 676FBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
53 In Stock |
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$283.4000 | Buy Now |
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DISTI #
XC3S1400AN-5FGG676
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Avnet Americas | FPGA Spartan-3AN Family 1.4M Gates 25344 Cells 770MHz 90nm Technology 1.2V 676-Pin FBGA - Trays (Alt: XC3S1400AN-5FGG676) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 0 |
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$242.3070 | Buy Now |
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DISTI #
217-S1400AN-5FGG676C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC3S1400AN-5FGG676C RoHS: Compliant | 97 |
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$283.3700 | Buy Now |
Part Details for XC3S1400AN-5FGG676C
XC3S1400AN-5FGG676C CAD Models
XC3S1400AN-5FGG676C Part Data Attributes
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XC3S1400AN-5FGG676C
AMD
Buy Now
Datasheet
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Compare Parts:
XC3S1400AN-5FGG676C
AMD
Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 770MHz, 25344-Cell, CMOS, PBGA676, FBGA-676
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 770 MHz | |
| Combinatorial Delay of a CLB-Max | 0.62 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2816 | |
| Number of Equivalent Gates | 1400000 | |
| Number of Inputs | 502 | |
| Number of Logic Cells | 25344 | |
| Number of Outputs | 408 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2816 CLBS, 1400000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |