Part Details for XC3S2000-4FG456C by AMD
Overview of XC3S2000-4FG456C by AMD
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Part Details for XC3S2000-4FG456C
XC3S2000-4FG456C CAD Models
XC3S2000-4FG456C Part Data Attributes
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XC3S2000-4FG456C
AMD
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Datasheet
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XC3S2000-4FG456C
AMD
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA456, 23 X 23 MM, FBGA-456
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 23 X 23 MM, FBGA-456 | |
Reach Compliance Code | not_compliant | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 630 MHz | |
Combinatorial Delay of a CLB-Max | 0.61 ns | |
JESD-30 Code | S-PBGA-B456 | |
JESD-609 Code | e0 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 5120 | |
Number of Equivalent Gates | 2000000 | |
Number of Inputs | 333 | |
Number of Logic Cells | 46080 | |
Number of Outputs | 333 | |
Number of Terminals | 456 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 5120 CLBS, 2000000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 225 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.6 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm |