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Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256, FTBGA-256
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S200AN-4FTG256I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
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XC3S200AN-4FTG256I
AMD
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Datasheet
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XC3S200AN-4FTG256I
AMD
Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256, FTBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | FTBGA-256 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 667 MHz | |
Combinatorial Delay of a CLB-Max | 0.71 ns | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 448 | |
Number of Equivalent Gates | 200000 | |
Number of Inputs | 195 | |
Number of Logic Cells | 4032 | |
Number of Outputs | 160 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 448 CLBS, 200000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for XC3S200AN-4FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S200AN-4FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
XC3S200A-4FTG256C | AMD Xilinx | $4.9093 | Field Programmable Gate Array, 448 CLBs, 200000 Gates, 250MHz, 4032-Cell, CMOS, PBGA256, LEAD FREE, FPTBGA-256 | XC3S200AN-4FTG256I vs XC3S200A-4FTG256C |
XA3S200A-4FTG256Q | AMD Xilinx | Check for Price | Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256, LEAD FREE, MS-034, FTBGA-256 | XC3S200AN-4FTG256I vs XA3S200A-4FTG256Q |
XC3S200AN-4FT256I | AMD | Check for Price | Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256, FTBGA-256 | XC3S200AN-4FTG256I vs XC3S200AN-4FT256I |
XC3S200A-4FT256C | AMD | Check for Price | Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256, FTBGA-256 | XC3S200AN-4FTG256I vs XC3S200A-4FT256C |