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Programmable Logic / Field Programmable Gate Arrays / XC3S400-4FTG256I
Datasheets
XC3S400-4FTG256I by:

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256

Part Details for XC3S400-4FTG256I by AMD

Results Overview of XC3S400-4FTG256I by AMD

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XC3S400-4FTG256I Information

XC3S400-4FTG256I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Part Details for XC3S400-4FTG256I

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XC3S400-4FTG256I Part Data Attributes

Parametric Data
XC3S400-4FTG256I AMD
Buy Now Datasheet
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XC3S400-4FTG256I AMD Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description 17 X 17 MM, LEAD FREE, FTBGA-256
Reach Compliance Code compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 896
Number of Equivalent Gates 400000
Number of Inputs 173
Number of Logic Cells 8064
Number of Outputs 173
Number of Terminals 256
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 896 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for XC3S400-4FTG256I

This table gives cross-reference parts and alternative options found for XC3S400-4FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S400-4FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC3S400-4FTG256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FTG256C
XC3S400-4FT256I AMD Xilinx $11.4151 Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FT256I
XC3S400-4FT256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FT256C
XC3S400-4FT256I AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FT256I
XC3S400-4FTG256I AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FTG256I
XC3S400-4FT256C AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256 XC3S400-4FTG256I vs XC3S400-4FT256C

XC3S400-4FTG256I Related Parts

XC3S400-4FTG256I Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for XC3S400-4FTG256I is -40°C to 100°C.

  • To implement a CDC in XC3S400-4FTG256I, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.

  • The maximum frequency achievable with XC3S400-4FTG256I depends on the design complexity and the clocking architecture. However, the FPGA can support clock frequencies up to 350 MHz.

  • To optimize power consumption in XC3S400-4FTG256I, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, optimize your design for low power consumption by minimizing switching activity and using low-power IP cores.

  • Yes, XC3S400-4FTG256I is suitable for high-reliability applications due to its radiation-hardened design and error correction features. However, additional testing and validation may be required for specific applications.

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