Part Details for XC3S50-5TQG144C by AMD
Overview of XC3S50-5TQG144C by AMD
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Part Details for XC3S50-5TQG144C
XC3S50-5TQG144C CAD Models
XC3S50-5TQG144C Part Data Attributes
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XC3S50-5TQG144C
AMD
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Datasheet
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XC3S50-5TQG144C
AMD
Field Programmable Gate Array, 192 CLBs, 50000 Gates, 725MHz, 1728-Cell, CMOS, PQFP144, 22 X 22 MM, LEAD FREE, TQFP-144
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 22 X 22 MM, LEAD FREE, TQFP-144 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 725 MHz | |
Combinatorial Delay of a CLB-Max | 0.53 ns | |
JESD-30 Code | S-PQFP-G144 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 192 | |
Number of Equivalent Gates | 50000 | |
Number of Inputs | 97 | |
Number of Logic Cells | 1728 | |
Number of Outputs | 97 | |
Number of Terminals | 144 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 192 CLBS, 50000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP144,.87SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 20 mm |