Part Details for XC4VFX12-11SFG363C by AMD
Overview of XC4VFX12-11SFG363C by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC4VFX12-11SFG363C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC4VFX12-11SFG363C-ND
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DigiKey | IC FPGA 240 I/O 363FCBGA Min Qty: 90 Lead time: 25 Weeks Container: Tray | Temporarily Out of Stock |
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$280.8000 | Buy Now |
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DISTI #
XC4VFX12-11SFG363C
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Avnet Americas | FPGA Virtex-4 FX Family 12312 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA - Trays (Alt: XC4VFX12-11SFG363C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 25 Weeks, 0 Days Container: Tray | 0 |
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$273.2400 | Buy Now |
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DISTI #
217-4VFX12-11SFG363C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC4VFX12-11SFG363C - Pb-free RoHS: Compliant | 0 |
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$300.0000 | Order Now |
Part Details for XC4VFX12-11SFG363C
XC4VFX12-11SFG363C CAD Models
XC4VFX12-11SFG363C Part Data Attributes
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XC4VFX12-11SFG363C
AMD
Buy Now
Datasheet
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Compare Parts:
XC4VFX12-11SFG363C
AMD
Field Programmable Gate Array, 1368 CLBs, 1181MHz, 12312-Cell, CMOS, PBGA363, LEAD FREE, FBGA-363
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | LEAD FREE, FBGA-363 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 25 Weeks | |
| Clock Frequency-Max | 1181 MHz | |
| Combinatorial Delay of a CLB-Max | 0.17 ns | |
| JESD-30 Code | S-PBGA-B363 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 1368 | |
| Number of Inputs | 240 | |
| Number of Logic Cells | 12312 | |
| Number of Outputs | 240 | |
| Number of Terminals | 363 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1368 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA363,20X20,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.99 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |