Part Details for XC4VFX20-11FF672I by AMD
Overview of XC4VFX20-11FF672I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC4VFX20-11FF672I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC4VFX20-11FF672I-ND
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DigiKey | IC FPGA 320 I/O 672FCBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$912.6000 | Buy Now |
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DISTI #
XC4VFX20-11FF672I
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Avnet Americas | FPGA Virtex-4 FX Family 19224 Cells 90nm (CMOS) Technology 1.2V 672-Pin FCBGA - Trays (Alt: XC4VFX20-11FF672I) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$888.0300 | Buy Now |
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DISTI #
217-C4VFX20-11FF672I
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Mouser Electronics | FPGA - Field Programmable Gate Array Disconnect standard BOMBOM fix route to Ed R only | 0 |
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$912.5100 | Order Now |
Part Details for XC4VFX20-11FF672I
XC4VFX20-11FF672I CAD Models
XC4VFX20-11FF672I Part Data Attributes
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XC4VFX20-11FF672I
AMD
Buy Now
Datasheet
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Compare Parts:
XC4VFX20-11FF672I
AMD
Field Programmable Gate Array, 2136 CLBs, 1181MHz, 19224-Cell, CMOS, PBGA672, FBGA-672
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | not_compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 1181 MHz | |
| Combinatorial Delay of a CLB-Max | 0.17 ns | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 2136 | |
| Number of Inputs | 320 | |
| Number of Logic Cells | 19224 | |
| Number of Outputs | 320 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2136 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 220 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |