There are no models available for this part yet.
Overview of XC6SLX150T-3CSG484I by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XC6SLX150T-3CSG484I by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
XC6SLX150T-3CSG484I-ND
|
DigiKey | IC FPGA 296 I/O 484CSBGA Min Qty: 84 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$460.2000 | Buy Now | |
DISTI #
XC6SLX150T-3CSG484
|
Avnet Americas | FPGA Spartan-6 LXT Family 147443 Cells 45nm (CMOS) Technology 1.2V 484-Pin CSBGA - Trays (Alt: XC6SLX150T-3CSG484) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
|
$447.8100 | Buy Now | |
DISTI #
217-6SLX150T3CSG484I
|
Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX150T-3CSG484I RoHS: Compliant | 32 |
|
$460.1500 | Buy Now |
CAD Models for XC6SLX150T-3CSG484I by AMD
Part Data Attributes for XC6SLX150T-3CSG484I by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
12 Weeks
|
Samacsys Manufacturer
|
AMD
|
Clock Frequency-Max
|
862 MHz
|
Combinatorial Delay of a CLB-Max
|
0.21 ns
|
JESD-30 Code
|
S-PBGA-B484
|
JESD-609 Code
|
e1
|
Length
|
19 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
11519
|
Number of Inputs
|
296
|
Number of Logic Cells
|
147443
|
Number of Outputs
|
296
|
Number of Terminals
|
484
|
Operating Temperature-Max
|
100 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
11519 CLBS
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
FBGA
|
Package Equivalence Code
|
BGA484,22X22,32
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
260
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.8 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
19 mm
|
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