Part Details for XC6SLX16-N3CPG196I by AMD
Overview of XC6SLX16-N3CPG196I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC6SLX16-N3CPG196I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XC6SLX16-N3CPG196I-ND
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DigiKey | IC FPGA 106 I/O 196CSBGA Min Qty: 7 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$52.3600 | Buy Now |
DISTI #
XC6SLX16-N3CPG196I
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Avnet Americas | FPGA Spartan-6 9112 Logic Units 14579 Cells 280MHz 1.2V 196-Pin CSBGA Tray - Bulk (Alt: XC6SLX16-N3CPG196I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
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$47.3110 | Buy Now |
DISTI #
217-C6SLX16N3CPG196I
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX16-N3CPG196I RoHS: Compliant | 0 |
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$52.3500 | Order Now |
Part Details for XC6SLX16-N3CPG196I
XC6SLX16-N3CPG196I CAD Models
XC6SLX16-N3CPG196I Part Data Attributes
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XC6SLX16-N3CPG196I
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX16-N3CPG196I
AMD
Field Programmable Gate Array, 1139 CLBs, 806MHz, 14579-Cell, CMOS, PBGA196, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Clock Frequency-Max | 806 MHz | |
Combinatorial Delay of a CLB-Max | 0.26 ns | |
JESD-30 Code | S-PBGA-B196 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1139 | |
Number of Inputs | 106 | |
Number of Logic Cells | 14579 | |
Number of Outputs | 106 | |
Number of Terminals | 196 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1139 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA196,14X14,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 8 mm |