Part Details for XC6SLX75-L1CSG484C by AMD
Overview of XC6SLX75-L1CSG484C by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC6SLX75-L1CSG484C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC6SLX75-L1CSG484C-ND
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DigiKey | IC FPGA 328 I/O 484CSBGA Min Qty: 84 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$206.7000 | Buy Now |
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DISTI #
XC6SLX75-L1CSG484C
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Avnet Americas | FPGA Spartan-6 LX Family 74637 Cells 45nm (CMOS) Technology 1V 484-Pin CSBGA - Trays (Alt: XC6SLX75-L1CSG484C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$201.1350 | Buy Now |
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DISTI #
217-6SLX75-L1CSG484C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX75-L1CSG484C RoHS: Compliant | 168 |
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$206.6800 | Buy Now |
Part Details for XC6SLX75-L1CSG484C
XC6SLX75-L1CSG484C CAD Models
XC6SLX75-L1CSG484C Part Data Attributes
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XC6SLX75-L1CSG484C
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX75-L1CSG484C
AMD
Field Programmable Gate Array, 5831 CLBs, 74637-Cell, CMOS, PBGA484, 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 500 MHz | |
| Combinatorial Delay of a CLB-Max | 0.46 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 5831 | |
| Number of Inputs | 328 | |
| Number of Logic Cells | 74637 | |
| Number of Outputs | 328 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5831 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |