Part Details for XC7A12T-1CSG325C by AMD
Overview of XC7A12T-1CSG325C by AMD
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC7A12T-1CSG325C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
57AJ5887
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Newark | Fpga, Artix-7, 150I/O, Csbga-325 Rohs Compliant: Yes |Amd XC7A12T-1CSG325C RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 96 |
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$41.5700 | Buy Now |
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DISTI #
XC7A12T-1CSG325C-ND
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DigiKey | IC FPGA 150 I/O 324CSBGA Min Qty: 9 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$41.5800 | Buy Now |
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DISTI #
XC7A12T-1CSG325C
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Avnet Americas | FPGA Artix-7 Family 12800 Cells 28nm 1V 325-Pin FCBGA Tray - Trays (Alt: XC7A12T-1CSG325C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$37.5705 | Buy Now |
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DISTI #
217-XC7A12T-1CSG325C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7A12T-1CSG325C RoHS: Compliant | 0 |
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$41.5700 | Order Now |
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DISTI #
XC7A12T-1CSG325C
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Avnet Asia | FPGA Artix-7 Family 12800 Cells 28nm 1V 325-Pin FCBGA Tray (Alt: XC7A12T-1CSG325C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days | 0 |
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$34.9412 / $59.4000 | Buy Now |
Part Details for XC7A12T-1CSG325C
XC7A12T-1CSG325C CAD Models
XC7A12T-1CSG325C Part Data Attributes
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XC7A12T-1CSG325C
AMD
Buy Now
Datasheet
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Compare Parts:
XC7A12T-1CSG325C
AMD
Field Programmable Gate Array, 1098MHz, 12800-Cell, PBGA325,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 1098 MHz | |
| Combinatorial Delay of a CLB-Max | 1.27 ns | |
| JESD-30 Code | S-PBGA-B325 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1000 | |
| Number of Inputs | 150 | |
| Number of Logic Cells | 12800 | |
| Number of Outputs | 150 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1000 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA325,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | HKMG | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |