Part Details for XC7A15T-2FTG256C by AMD Xilinx
Overview of XC7A15T-2FTG256C by AMD Xilinx
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Computing and Data Storage
Telecommunications
Price & Stock for XC7A15T-2FTG256C
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
47AC6437
|
Newark | Fpga, Artix-7, 170 I/O, Ftbga-256, No. Of Logic Blocks:2600, No. Of Macrocells:16640, Fpga Family:Artix-7, Logic Case Style:Ftbga, No. Of Pins:256Pins, No. Of Speed Grades:2, Total Ram Bits:900Kbit, No. Of I/O S:170I/O S, Clock Rohs Compliant: Yes |Amd Xilinx XC7A15T-2FTG256C Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$43.3200 | Buy Now |
|
Quest Components | FIELD PROGRAMMABLE GATE ARRAY, 1300 CLBS, 1286MHZ, 16640-CELL, PBGA256 | 864 |
|
$62.6741 / $83.5654 | Buy Now |
|
Chip1Cloud | IC FPGA 170 I/O 256FTBGA | 10000 |
|
RFQ | |
DISTI #
2831237
|
element14 Asia-Pacific | FPGA, ARTIX-7, 170 I/O, FTBGA-256 RoHS: Compliant Min Qty: 1 Container: Each | 0 |
|
$41.8846 | Buy Now |
DISTI #
2831237
|
Farnell | FPGA, ARTIX-7, 170 I/O, FTBGA-256 RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 1 Days Container: Each | 0 |
|
$41.8924 | Buy Now |
|
MacroQuest Electronics | FPGA Artix-7 16640 Cells 28nm Technology 1V 236-Pin FBGA | 1000 |
|
$35.3200 / $36.8400 | Buy Now |
Part Details for XC7A15T-2FTG256C
XC7A15T-2FTG256C CAD Models
XC7A15T-2FTG256C Part Data Attributes:
|
XC7A15T-2FTG256C
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XC7A15T-2FTG256C
AMD Xilinx
Field Programmable Gate Array, 1300 CLBs, PBGA256, FBGA-256
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | LFBGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 65 Weeks | |
Clock Frequency-Max | 1286 MHz | |
Combinatorial Delay of a CLB-Max | 1.05 ns | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1300 | |
Number of Inputs | 250 | |
Number of Logic Cells | 16640 | |
Number of Outputs | 250 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 1300 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |