There are no models available for this part yet.
Overview of XC7K325T-1FBG900C by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 6 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XC7K325T-1FBG900C by AMD Xilinx
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Win Source Electronics | IC FPGA 500 I/O 900FCBGA | 210 |
|
$325.0000 | Buy Now |
CAD Models for XC7K325T-1FBG900C by AMD Xilinx
Part Data Attributes for XC7K325T-1FBG900C by AMD Xilinx
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
BGA
|
Pin Count
|
900
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.D
|
HTS Code
|
8542.39.00.01
|
Clock Frequency-Max
|
1098 MHz
|
Combinatorial Delay of a CLB-Max
|
0.74 ns
|
JESD-30 Code
|
S-PBGA-B900
|
JESD-609 Code
|
e1
|
Length
|
31 mm
|
Moisture Sensitivity Level
|
4
|
Number of CLBs
|
25475
|
Number of Inputs
|
500
|
Number of Logic Cells
|
326080
|
Number of Outputs
|
500
|
Number of Terminals
|
900
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
25475 CLBS
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA900,30X30,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.54 mm
|
Supply Voltage-Max
|
1.03 V
|
Supply Voltage-Min
|
0.97 V
|
Supply Voltage-Nom
|
1 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
31 mm
|
Alternate Parts for XC7K325T-1FBG900C
This table gives cross-reference parts and alternative options found for XC7K325T-1FBG900C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7K325T-1FBG900C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XC7K325T-1FB900I | Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 | AMD Xilinx | XC7K325T-1FBG900C vs XC7K325T-1FB900I |
XC7K325T-1FB900C | Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA900, | AMD Xilinx | XC7K325T-1FBG900C vs XC7K325T-1FB900C |
XC7K325T-1FBG900E | Field Programmable Gate Array, PBGA900, LEAD FREE, FBGA-900 | AMD Xilinx | XC7K325T-1FBG900C vs XC7K325T-1FBG900E |
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