Part Details for XC7K355T-1FF901I by AMD
Overview of XC7K355T-1FF901I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC7K355T-1FF901I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC7K355T-1FF901I-ND
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DigiKey | IC FPGA 300 I/O 901FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$3,722.5000 | Buy Now |
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DISTI #
XC7K355T-1FF901I
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Avnet Americas | FPGA Kintex-7 356160 Cells 28nm Technology 1V 901-Pin FC-BGA - Trays (Alt: XC7K355T-1FF901I) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3,767.1700 | Buy Now |
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DISTI #
217-XC7K355T-1FF901I
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7K355T-1FF901I | 0 |
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$3,662.5200 | Order Now |
Part Details for XC7K355T-1FF901I
XC7K355T-1FF901I CAD Models
XC7K355T-1FF901I Part Data Attributes
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XC7K355T-1FF901I
AMD
Buy Now
Datasheet
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Compare Parts:
XC7K355T-1FF901I
AMD
Field Programmable Gate Array, 1818MHz, 356160-Cell, CMOS, PBGA900,
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Reach Compliance Code | not_compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 1818 MHz | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Number of Inputs | 300 | |
| Number of Logic Cells | 356160 | |
| Number of Outputs | 300 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |