There are no models available for this part yet.
Overview of XC7VX415T-1FFG1157C by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for XC7VX415T-1FFG1157C by AMD
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
XC7VX415T-1FFG1157C-ND
|
DigiKey | IC FPGA 600 I/O 1157FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$5,330.0000 | Buy Now | |
DISTI #
XC7VX415T-1FFG1157
|
Avnet Americas | FPGA Virtex-7 XT Family 412160 Cells 28nm Technology 1V 1157-Pin FC-BGA - Trays (Alt: XC7VX415T-1FFG1157) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$5,393.9600 | Buy Now | |
DISTI #
XC7VX415T-1FFG1157C
|
Avnet Asia | FPGA Virtex-7 XT Family 412160 Cells 28nm Technology 1V 1157-Pin FC-BGA (Alt: XC7VX415T-1FFG1157C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days | 0 |
|
$5,016.4707 / $5,610.5264 | Buy Now |
CAD Models for XC7VX415T-1FFG1157C by AMD
Part Data Attributes for XC7VX415T-1FFG1157C by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
16 Weeks
|
Samacsys Manufacturer
|
AMD
|
Clock Frequency-Max
|
1818 MHz
|
Combinatorial Delay of a CLB-Max
|
0.74 ns
|
JESD-30 Code
|
S-PBGA-B1157
|
JESD-609 Code
|
e1
|
Length
|
35 mm
|
Moisture Sensitivity Level
|
4
|
Number of CLBs
|
32200
|
Number of Inputs
|
600
|
Number of Logic Cells
|
412160
|
Number of Outputs
|
600
|
Number of Terminals
|
1157
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
32200 CLBS
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA1156,34X34,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
245
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
3.35 mm
|
Supply Voltage-Max
|
1.03 V
|
Supply Voltage-Min
|
0.97 V
|
Supply Voltage-Nom
|
1 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
35 mm
|
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