Part Details for XC7Z007S-2CLG225E by AMD
Overview of XC7Z007S-2CLG225E by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC7Z007S-2CLG225E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
32AC9832
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Newark | Psoc, Arm Cortex-A9, 766Mhz, Bga-225, Product Range:Zynq Family 7000S Series Microprocessors, Cpu Speed:766Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Bga, No. Of Pins:225Pins, Msl:-, Ic Case/Package:Bga Rohs Compliant: Yes |Amd XC7Z007S-2CLG225E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$78.6200 | Buy Now |
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DISTI #
122-2000-ND
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DigiKey | IC SOC CORTEX-A9 766MHZ 225BGA Min Qty: 160 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$75.6000 | Buy Now |
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DISTI #
XC7Z007S-2CLG225E
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Avnet Americas | Zynq-7000 All Programmable SoC Family - Trays (Alt: XC7Z007S-2CLG225E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$68.3100 | Buy Now |
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DISTI #
217-C7Z007S-2CLG225E
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Mouser Electronics | SoC FPGA XC7Z007S-2CLG225E RoHS: Compliant | 0 |
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$75.5900 | Order Now |
Part Details for XC7Z007S-2CLG225E
XC7Z007S-2CLG225E CAD Models
XC7Z007S-2CLG225E Part Data Attributes
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XC7Z007S-2CLG225E
AMD
Buy Now
Datasheet
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Compare Parts:
XC7Z007S-2CLG225E
AMD
SoC, CMOS, PBGA225, CSBGA-225
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | CSBGA-225 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B225 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA225,15X15,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |