Part Details for XC7Z007S-2CLG225I by AMD Xilinx
Overview of XC7Z007S-2CLG225I by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for XC7Z007S-2CLG225I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
32AC9833
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Newark | Psoc, Arm Cortex-A9, 766Mhz, Bga-225, Product Range:Zynq Family 7000S Series Microprocessors, Cpu Speed:766Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Bga, No. Of Pins:225Pins, Msl:-, Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z007S-2CLG225I Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$82.1900 | Buy Now |
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DISTI #
2760163
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element14 Asia-Pacific | PSOC, ARM CORTEX-A9, 766MHZ, BGA-225 RoHS: Compliant Min Qty: 1 Container: Each | 0 |
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$83.5076 | Buy Now |
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DISTI #
2760163
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Farnell | PSOC, ARM CORTEX-A9, 766MHZ, BGA-225 RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 1 Days Container: Each | 0 |
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$79.1188 | Buy Now |
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MacroQuest Electronics | FPGA Zynq-7000 Family 23000 Cells 667MHz 28nm 1V 225-Pin WCBGA Tray | 1200 |
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$59.6400 / $68.7600 | Buy Now |
Part Details for XC7Z007S-2CLG225I
XC7Z007S-2CLG225I CAD Models
XC7Z007S-2CLG225I Part Data Attributes:
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XC7Z007S-2CLG225I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC7Z007S-2CLG225I
AMD Xilinx
Multifunction Peripheral, CMOS, PBGA225, BGA-225
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | CSBGA-225 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks | |
| Date Of Intro | 2017-06-07 | |
| JESD-30 Code | S-PBGA-B225 | |
| Length | 13 mm | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA225,15X15,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |