Part Details for XC7Z100-1FFG1156I by AMD
Overview of XC7Z100-1FFG1156I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC7Z100-1FFG1156I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC7Z100-1FFG1156I-ND
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DigiKey | IC SOC CORTEX-A9 667MHZ 1156BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$3,672.5000 | Buy Now |
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DISTI #
XC7Z100-1FFG1156I
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Avnet Americas | MPU Zynq-7000 RISC 32-Bit 667MHz 1.5V/2V/2.5V 1156-Pin F-BGA - Trays (Alt: XC7Z100-1FFG1156I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$3,716.5700 | Buy Now |
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DISTI #
217-C7Z100-1FFG1156I
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Mouser Electronics | SoC FPGA XC7Z100-1FFG1156I RoHS: Compliant | 0 |
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$3,613.3300 | Order Now |
Part Details for XC7Z100-1FFG1156I
XC7Z100-1FFG1156I CAD Models
XC7Z100-1FFG1156I Part Data Attributes
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XC7Z100-1FFG1156I
AMD
Buy Now
Datasheet
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Compare Parts:
XC7Z100-1FFG1156I
AMD
SoC, CMOS, PBGA1156, FBGA-1156
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-1156 | |
| Reach Compliance Code | not_compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | S-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1156 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.1 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |