Datasheets
XCF01SVOG20C by: AMD Xilinx

Configuration Memory, 1MX1, Serial, CMOS, PDSO20, LEAD-FREE, PLASTIC, TSSOP-20

Part Details for XCF01SVOG20C by AMD Xilinx

Results Overview of XCF01SVOG20C by AMD Xilinx

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XCF01SVOG20C Information

XCF01SVOG20C by AMD Xilinx is an EEPROM.
EEPROMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for XCF01SVOG20C

Part # Distributor Description Stock Price Buy
Bristol Electronics   3
RFQ
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 5920 STOCK
RFQ
Win Source Electronics IC PROM SRL FOR 1M GATE 20-TSSOP 7484
  • 3 $20.4513
  • 6 $19.1319
  • 9 $18.4722
  • 12 $17.1528
  • 16 $16.4930
  • 19 $15.8333
$15.8333 / $20.4513 Buy Now

Part Details for XCF01SVOG20C

XCF01SVOG20C CAD Models

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XCF01SVOG20C Part Data Attributes

XCF01SVOG20C AMD Xilinx
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XCF01SVOG20C AMD Xilinx Configuration Memory, 1MX1, Serial, CMOS, PDSO20, LEAD-FREE, PLASTIC, TSSOP-20
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code TSSOP
Package Description LEAD-FREE, PLASTIC, TSSOP-20
Pin Count 20
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Data Retention Time-Min 20
Endurance 20000 Write/Erase Cycles
JESD-30 Code R-PDSO-G20
JESD-609 Code e3
Length 6.5024 mm
Memory Density 1048576 bit
Memory IC Type CONFIGURATION MEMORY
Memory Width 1
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 20
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX1
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP20,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.19 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 4.4 mm

Alternate Parts for XCF01SVOG20C

This table gives cross-reference parts and alternative options found for XCF01SVOG20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCF01SVOG20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XCF01SVOG20C0100 AMD Xilinx Check for Price Configuration Memory, 1MX1, Serial, CMOS, PDSO20, LEAD-FREE, PLASTIC, TSSOP-20 XCF01SVOG20C vs XCF01SVOG20C0100
XCF01SVOG20CES AMD Xilinx Check for Price Configuration Memory, 1MX1, Serial, CMOS, PDSO20, LEAD FREE, PLASTIC, TSSOP-20 XCF01SVOG20C vs XCF01SVOG20CES

XCF01SVOG20C Related Parts

XCF01SVOG20C Frequently Asked Questions (FAQ)

  • The recommended PCB layout and routing for the XCF01SVOG20C can be found in the Xilinx PCB Design Guide (UG583) and the XCF01SVOG20C PCB Design Files, which provide guidelines for signal integrity, power integrity, and thermal management.

  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).

  • The XCF01SVOG20C has a maximum junction temperature of 100°C. Ensure good airflow, use thermal interfaces such as heat sinks or thermal tapes, and follow the thermal management guidelines in the Xilinx Thermal Management Guide (UG586) to prevent overheating.

  • Use the Xilinx Secure Boot and Secure Firmware Update solution, which provides a secure boot mechanism and secure firmware update process using cryptographic techniques such as encryption and digital signatures.

  • The XCF01SVOG20C is supported by the Xilinx Vitis Unified Software Platform, which provides a comprehensive development environment including the Vitis IDE, Vivado Design Suite, and Xilinx Runtime (XRT).

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