Part Details for XCR3064XL-7CP56I by AMD
Overview of XCR3064XL-7CP56I by AMD
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Part Details for XCR3064XL-7CP56I
XCR3064XL-7CP56I CAD Models
XCR3064XL-7CP56I Part Data Attributes
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XCR3064XL-7CP56I
AMD
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Datasheet
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XCR3064XL-7CP56I
AMD
EE PLD, 7.5ns, 64-Cell, CMOS, PBGA56, 0.50 MM PITCH, CSP-56
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 0.50 MM PITCH, CSP-56 | |
Reach Compliance Code | not_compliant | |
Samacsys Manufacturer | AMD | |
Additional Feature | YES | |
Clock Frequency-Max | 119 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B56 | |
JESD-609 Code | e0 | |
JTAG BST | YES | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 48 | |
Number of Inputs | 48 | |
Number of Macro Cells | 64 | |
Number of Outputs | 48 | |
Number of Terminals | 56 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 0 DEDICATED INPUTS, 48 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA56,10X10,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 240 | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 7.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |