Part Details for XCR3064XL-7CS48I by AMD
Overview of XCR3064XL-7CS48I by AMD
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Part Details for XCR3064XL-7CS48I
XCR3064XL-7CS48I CAD Models
XCR3064XL-7CS48I Part Data Attributes
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XCR3064XL-7CS48I
AMD
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Datasheet
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XCR3064XL-7CS48I
AMD
EE PLD, 7.5ns, 64-Cell, CMOS, PBGA48, 0.80 MM PITCH, CSP-48
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 0.80 MM PITCH, CSP-48 | |
| Reach Compliance Code | not_compliant | |
| Samacsys Manufacturer | AMD | |
| Additional Feature | YES | |
| Clock Frequency-Max | 119 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B48 | |
| JESD-609 Code | e0 | |
| JTAG BST | YES | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 40 | |
| Number of Inputs | 40 | |
| Number of Macro Cells | 64 | |
| Number of Outputs | 40 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 0 DEDICATED INPUTS, 40 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,7X7,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | EE PLD | |
| Propagation Delay | 7.5 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7 mm |