Part Details for XCR3256XL-10FT256C by AMD Xilinx
Overview of XCR3256XL-10FT256C by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XCR3256XL-10FT256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 54 |
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$32.8440 / $38.6400 | Buy Now |
Part Details for XCR3256XL-10FT256C
XCR3256XL-10FT256C CAD Models
XCR3256XL-10FT256C Part Data Attributes
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XCR3256XL-10FT256C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCR3256XL-10FT256C
AMD Xilinx
EE PLD, 10ns, 256-Cell, CMOS, PBGA256, FBGA-256
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | YES | |
| Clock Frequency-Max | 105 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| JTAG BST | YES | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 164 | |
| Number of Macro Cells | 256 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | EE PLD | |
| Propagation Delay | 10 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XCR3256XL-10FT256C
This table gives cross-reference parts and alternative options found for XCR3256XL-10FT256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3256XL-10FT256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCR3256XL-10FTG256C | EE PLD, 10ns, 256-Cell, CMOS, PBGA256, FBGA-256 | AMD Xilinx | XCR3256XL-10FT256C vs XCR3256XL-10FTG256C |