Part Details for XCR3512XL-10FG324I by AMD Xilinx
Overview of XCR3512XL-10FG324I by AMD Xilinx
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Industrial Automation
Price & Stock for XCR3512XL-10FG324I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
10AH1700
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Newark | Xcr3512Xl-10Fg324I Rohs Compliant: No |Amd Xilinx XCR3512XL-10FG324I Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$330.2000 | Buy Now |
Part Details for XCR3512XL-10FG324I
XCR3512XL-10FG324I CAD Models
XCR3512XL-10FG324I Part Data Attributes
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XCR3512XL-10FG324I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCR3512XL-10FG324I
AMD Xilinx
EE PLD, 10ns, 512-Cell, CMOS, PBGA324, FBGA-324
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 12 Weeks | |
| Additional Feature | YES | |
| Clock Frequency-Max | 97 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e0 | |
| JTAG BST | YES | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 260 | |
| Number of Macro Cells | 512 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 0 DEDICATED INPUTS, 260 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | EE PLD | |
| Propagation Delay | 10 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.5 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for XCR3512XL-10FG324I
This table gives cross-reference parts and alternative options found for XCR3512XL-10FG324I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3512XL-10FG324I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCR3512XL-12FGG324I | EE PLD, 12ns, 512-Cell, CMOS, PBGA324, FBGA-324 | AMD Xilinx | XCR3512XL-10FG324I vs XCR3512XL-12FGG324I |